Support for Intel® Core™ i7 processors/Intel® Core™ i5 processors/ Intel® Core™ i3 processors/Intel® Pentium® processors/ Intel® Celeron® processors in the LGA1151 package
L3 cache varies with CPU
Socket
LGA1151
Chipset
Intel® Z170 Express Chipset
Memory Support
4 x DDR4 DIMM sockets supporting up to 64 GB of system memory
* Due to a Windows 32-bit operating system limitation, when more than 4 GB of physical memory is installed, the actual memory size displayed will be less than the size of the physical memory installed.
Dual channel memory architecture
Support for DDR4 3866(O.C)/3733(O.C)/3666(O.C) /3600(O.C.) /3466(O.C.) /3400(O.C.) /3333(O.C.) /3300(O.C.) /3200(O.C.) /3000(O.C.) /2800(O.C.) /2666(O.C.) /2400(O.C.) /2133 MHz memory modules/li>
Support for ECC UDIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC UDIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
Multi Graphic Support
Support for 4-Way/3-Way/2-Way AMD CrossFire™/NVIDIA® SLI™ technology
LAN
2 x Qualcomm® Atheros Killer E2400 chips (10/100/1000 Mbit)
Wireless Data Network
Killer™ Wireless-AC 1535
Wi-Fi 802.11 a/b/g/n/ac, supporting 2.4/5 GHz Dual-Band
Bluetooth 4.1
Support for 11ac wireless standard and up to 867 Mbps data rate
Form Factor
E-ATX Form Factor; 30.5cm x 26.4cm
Operating System Support
Support for Windows 10/8.1/7
Sound
Creative® Sound Core 3D chip
2 x JRC NJM2114 and 1 x TI Burr Brown® OPA2134 operational amplifiers
Support for Sound Blaster Recon3Di
High Definition Audio
2/5.1-channel
Support for S/PDIF Out